Stories – Trends
Trends & Technologies – How Comet is exploring for the better
X-ray: an up-and-coming technology in the semiconductor industry.
Microchips are the key building blocks of our digital world. To meet the growing demand for technologies such as electromobility, autonomous driving, artificial intelligence, cloud computing and 5G-enabled smartphones, more and more powerful chips are needed. This brings with it various technological challenges – and new opportunities in the semiconductor industry for Comet x-ray technology.
Until now, producing ever more powerful microchips has mainly meant ever smaller microchip structures, with progressively more transistors on the same area of silicon. However, for structures in the nanometer range – and probably into the sub-nanometer realm from 2030 – the technology will reach physical limits in the foreseeable future.
This is where x-ray comes in as an accelerator for shorter time-to-market and higher yields. “Until recently, x-ray received little attention in the semiconductor industry because the technology simply wasn’t ready yet. It was too slow and the resolution was not high enough,” says Isabella Drolz. “The 2.5D x-ray inspection technology that we have evolved to the next level with intelligent data processing now enables quick and easy analysis of critical defects in minutes.” Our latest x-ray technology finds critical flaws in a range below 100 micrometers down to the nanometer scale, at an acceptable speed. It is non-destructive and, thanks to automated defect recognition, it gives our customers information within a few minutes that they can use to improve their processes. For Isabella Drolz, the conclusion is obvious: “Non-destructive inspection technologies are the future.”